Omar Abed is CTO of InvenSense, leading innovation for next generation MEMS sensor products and generating strategy for ensuring competitive advantage and technology leadership. Prior to serving as CTO, Omar led TDK Invensense as President & CEO and led the Microphone Business Unit helping to drive the business for innovation and high growth. Before joining TDK, Omar led TE Connectivity’s $300M pressure sensor business as GM & VP. Previously, he was President & CEO of SMI, transforming the company to multiple years of double-digit growth before its acquisition. His earlier experience includes roles at Analog Devices and Kavlico Corporation, driving MEMS strategy and ultra-low-power sensor design. 

He holds a B.S. in Electrical Engineering and Computer Science from UC Berkeley and an M.S. in Electrical Engineering (Analog & RF Circuit Design) from USC and is an alumnus of Harvard Business School through the PLD program. Omar holds seven patents across several MEMS technologies. 

Pankaj Aggarwal serves as the Vice President and GM of Consumer & Industrial BU at TDK InvenSense. He has the P&L responsibility of the ever-growing world-wide MEMS motion sensors that are shipped in practically all of the major worldwide brands of the Consumer and Industrial devices including Smartphone, AR/VR, Hearables, Wearables, Gaming, Robotics, Humanoids, AGV, Drones, PC, Navigation and others.  

Prior to his current role, Pankaj spent a decade at Qualcomm, where he led the global Control and Automation segment recently and Consumer Electronics connectivity business in the past. Overall, he has more than 25 years of experience leading and growing IoT business and have held prior leadership positions at Atheros, Plantronics, Motorola and Caterpillar with experience spanning strategic roadmap development, technology planning, product and program management, engineering execution, and business development. 

Pankaj holds a M.S. degree in Electrical Engineering (RF & Wireless Systems) from Bradley University and an MBA from Santa Clara University and is an alumnus of Stanford Graduate Business School through the SEP program. 

Dennis Chi is the VP & General Counsel of InvenSense, partnering with the business to provide counsel and strategic leadership in Commercial Transactions, Intellectual Property Strategy & Practice, Trade, Compliance, Licensing, Litigation Management, Regulatory, Employment and Risk Management, as well as M&A activity. Since joining InvenSense in 2014, he has focused his efforts on building and leading a forward-thinking legal organization with best-in-class support for both business facilitation and risk management. 

Prior to joining InvenSense, he has held roles at Broadcom, Hewlett-Packard, and the law firm Jones Day. 

Uday Mudoi is the General Manager of the Microphone Business Unit at TDK, leading a high-growth portfolio, strategic customer engagements, and product roadmaps across Consumer, Mobile, and IoT applications. Since joining TDK in 2019, he has overseen multiple businesses, including Industrial Motion and Pressure Sensors. Uday brings more than a decade of strategic leadership in the semiconductor industry.  

As VP of Marketing at Microsemi and Vitesse, he managed Ethernet networking and connectivity semiconductor and software products, driving a product strategy that delivered 80% annual revenue growth over three years and enabled Vitesse’s successful turnaround and acquisition. Earlier, he was part of the startup team that led Orologic from seed funding to acquisition.

Pavan Gupta joined TDK InvenSense in December 2021 as the Chief Operating Officer (COO). 

Prior to joining, Pavan served as a Director of Hardware Engineering at Apple. During his 6 years at Apple, Pavan led the development of Touch and Force sensing technologies on several generations of iPhones and Air Pods. Prior to that, Pavan spent 10 years at SiTime, a leader in MEMS timing space, growing into the role of Vice-President of Operations where he oversaw SiTime’s worldwide fabless manufacturing, logistics and planning, product and test engineering, and quality and reliability. Pavan has also worked at other MEMS-based companies including FormFactor and NanoGear, Inc. (formerly C Speed Corp). He started his career at IBM. 

Pavan received his MS from Stanford University and BS from UCLA, both in Mechanical Engineering. He holds 19 patents on topics ranging from MEMS, packaging, haptics, and force sensing.