About PCB Designed

Hello everyone ,I'm designing a MPU6050 PCB,but have some question,I read the datasheet it said：
“Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibited.Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response.These devices are designed with the drive frequencies as follows: X = 33±3Khz, Y = 30±3Khz, andZ=27±3Khz. To avoid harmonic coupling don’t route active signals in non-shielded signal planes directlybelow, or above the gyro package. Note: For best performance, design a ground plane under the e-pad toreduce PCB signal noise from the board on which the gyro device is mounted. If the gyro device is stackedunder an adjacent PCB board, design a ground plane directly above the gyro device to shield active signals from the adjacent PCB board.”
my question is what is "e-pad",my PCB is two layers do I need Polygons the bottom and the top layer about MPU6050(I'm sorry can not expiain clearly for my poor English).Beause one of my workmate designed a PCB but failed the MPU6050's data is abnormal,but he was Leaving the Company so I can not find the reason.I I wonder the problem is here.
Can anyone give me some guidances about MPU6050's PCB design,3Q very much!