I'd like to use MEMS microphones underwater, up to approx 10 bar of pressure (inside pipelines), for acoustic pattern recognition (leaks mostly). I'd ideally solder four mics on a thin PCB, bolt that to an aluminium carrier plate and seal it off by covering the whole in epoxy resin. There would be approx 2-3mm resin covering the mic can. For sealing it would make sense to use a bottom-ported mic. Would the mics still be able to pick up audio, with their ports blocked and covered in resin?