Mechanical pressure affects MEMS function

Hi,
we are using the MPU6500 in an industrial device that gets fully molded with resin in order to prevent from humidity and to make the product shock and vibration sturdy. We figured out that after the moulding process in our production the MPU6500, both, accelerometer and gyroscope show changed values in comparison to the pre-moulded status. Obviously the MPU6500 gets affected by the moulding. Maybe the resin applies some pressure to the MPU6500 housing which leads to changed MEMS behaviour.
Is there anybody out there who made similar experience? Can someone give a piece of advice on how this moulding effect can be reduced or even eliminated?
Every hint is highly appreciated.
Regards,
Wolfgang.