Well, I'm currently using an icm-20948 with a house calibration to improve sensor performance (accelerometer) and it works very well. On the other hand, we notice that it is affected when one presses on the sensor. A simple mechanical pressure on the sensor affects the calibration of the accelerometer. The sensor serves to do the motion analysis and must be inserted between the feet and the shoe so it is affected by the pressure. We tried to use the epoxy to reduce the impact of mechanical pressure on the accelerometer. We have a decrease but it is not enough. I would like to know if you have ever encountered this kind of problem. If so is that you can help us in encapsulation or other method to lessen the impact.
Hi,
we are using the MPU6500 in a device that gets fully molded with resin. We figured out that after the moulding the MPU6500, both, accwelerometer and gyroscope get affected by the moulding. I could imagine that there occurs some pressure from the resin to the MPU6500 housing.
Did you find out, how to insulate the MEMS device from external pressure?
Regards,
Wolfgang