According to the MPU-60X0 Data Sheet the exposed die pad should not be soldered because of thermo-mechanical stress. It also states for best results to place a ground plane under the e-pad to reduce signal noise.
I am looking for thoughts on the advantages and disadvantages of placing solder mask on the e-pad ground and tenting the vias on the e-pad ground.
Will solder mask lift the IC a bit and make it difficult to solder?
Cheers.
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