Dear there，
about IMU SMT，I notifiy the information of"The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak cycle (in a temperature humidity oven), and three consecutive solder reflow cycles, followed by functional device testing." in "AN-IVS-0002A-00-MEMS-Motion-Handling-and-Assembly-Guide-v4.2.pdf" file，what's the detail and real meanning for "three consecutive solder reflow cycles"? does it mean factory need to operate 3 times solder of reflow?
looking forward to your answer!
Thanks
Viola