I am talking to an ICM-20602 using the I2C interface and as the title suggests, I am getting huge offsets on the X and Y accelerometers (~10,000 lsb on the X and ~-20000 on the Y). Has anyone else experienced this?
I have double checked that self test is not enabled (it isn't) and looked at the offset registers (they have values but are tiny). I have tried different output sample rates, different ranges (the offset scales with the range. The big numbers above are in the +/-2 g range) and different bandwidths and nothing seems to make a difference.
I am using the ICM-20602 on a different board with a SPI interface and it works perfectly well with the same configurations.
Below is the configuration I am putting in the sensor:
ICM_SMPLRT_DIV, 0b00001001
ICM_CONFIG, 0b00000110
ICM_GYRO_CONFIG, 0b00000000
ICM_ACCEL_CONFIG, 0b00000000
ICM_ACCEL_CONFIG2, 0b00000110
ICM_LP_MODE_CFG, 0b00000000
ICM_FIFO_EN, 0b00000000
ICM_INT_PIN_CFG, 0b00000000
ICM_INT_ENABLE, 0b00000000
ICM_FIFO_WM_TH1, 0b00000000
ICM_FIFO_WM_TH2, 0b00000000
ICM_ACCEL_INTEL_CTRL, 0b00000000
ICM_PWR_MGMT_1, 0b00000001
ICM_PWR_MGMT_2, 0b00000000
ICM_I2C_IF, 0b00000000
ICM_USER_CTRL, 0b00000001
ICM_SIGNAL_PATH_RESET, 0b00000011
Could the device be broken? It is the second board I have had built, since the ICM-20602 on the first wouldn't communicate at all (they were bought at the same time).
Did you ever resolve this issue with the large offsets on the accelerometer?
Any news? I have large offsets in Y and Z.
In my case the problem appears to be that the sensor was damaged by excessive G forces during the manufacturing process. The sensor was at the edge of the PCB near the mouse-bites attaching the board to the panel. We suspect our CM was using too much force when depanelizing the boards after reflow. They were asked to use caution during the depanelization, and our number of failed sensors has been reduced. We also learned not to but the sensor near the board edge, especially near mouse-bites.
Thank you for the reply. I suspect the sensor might be damaged as well, but I also saw code written for this chip with a note on having to write to a secret register to solve a large offset issue. I do not think my chip was subjected to high shocks, but it was my first ever attempt at reflow soldering a LGA part by hand. I could have nuked it with thermal stress. I guess I will buy a few more and give it a second try. Again thank you for the reply.