Hi, in order to have best performance and avoid problems caused by moisture during the storing, I want to bake the components before using them.
What are the instructions regarding baking the ICM-42605 component before the smt assembly?
Thanks
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Hello,
Following document has reflow specifications for assembly: https://invensense.tdk.com/download-pdf/an-000393-imu-pcb-design-and-mems-assembly-guidelines/